1.0-2.5mm Thick High Yield Strength Copper Clad Laminate CCL Lamination Steel Plate Japanese Metallurgical NAS630 ESSP-CCL-400
1.Introduction of 1.0-2.5mm Thick High Yield Strength Copper Clad Laminate CCL Lamination Steel Plate Japanese Metallurgical NAS630 ESSP-CCL-400
Copper Clad Laminate CCL Lamination Steel Plate ESSP-CCL-400 is of our mature and reliable high-precision lamination steel plate special for CCL copper clad laminate lamination purpose.
We have been deeply involved in the CCL laminating auxiliary material industry for many years. We have been specializing in providing high-precision laminated steel plates and partition steel plate series, fully meeting the strict laminating requirements of large-sized CCL copper clad laminate. We mainly act as an agent for high-end lamination steel platesproduced by Japan, including NAS630&NAS301 (high expansion coefficient) precipitation hardening steel plates. The quality lamination steel plates have won the trust and satisfaction of CCL/PCB industry customers with its ultra-high hardness, optimized surface roughness, and excellent thermal conductivity.
performance parameters of Copper Clad Laminate CCL Lamination Steel Plate ESSP-CCL-400 at below:
|  Models
Items | NAS630 JAPAN | NAS301 JAPAN |
| Mass-Lam plate | Pin-lam plate | Mass-Lam plate | Pin-lam plate |
| Thickness | 1.0-2.5mm | 1.0-2.5mm | 1.0-1.8mm | 1.0-1.8mm |
| Width | ≤1300 | ≤1300 | ≤1060 | ≤1060 |
| Length | ≤2410 | ≤2410 | ≤3150 | ≤3150 |
| Thickness tolerance | ±0.05 | ±0.05 | ±0.05 | ±0.05 |
| Surface roughness (um) | Ra≤0.15 Rz≤1.5 | Ra≤0.15 Rz≤1.5 | Ra≤0.15 Rz≤1.5 | Ra≤0.15 Rz≤1.5 |
| Positioning hole to hole tolerance | -- | +0.1/-0mm | -- | +0.1/-0mm |
| Standard bushing slot tolerance | -- | +0.05/-0mm | -- | +0.05/-0mm |
| Warpage degree | ≤3mm/M | ≤3mm/M | ≤3mm/M | ≤3mm/M |
| L/W size tolerance | ±1mm | ±1mm | ±1mm | ±1mm |
| Yield strength | ≥1175 N/mm2 | ≥1175 N/mm2 | ≥1175 N/mm2 | ≥1175 N/mm2 |
| Tensile strength | ≥1400 N/mm2 | ≥1400 N/mm2 | ≥520 N/mm2 | ≥520 N/mm2 |
| Extensibility | ≥5% | ≥5% | ≥5% | ≥5% |
| Hardness HRC | 50HRC±2 | 50HRC±2 | 44HRC±2 | 44HRC±2 |
| Work temperature | ≤400℃ | ≤400℃ | ≤400℃ | ≤400℃ |
| Parallelism | ≤0.03 | ≤0.03 | ≤0.03 | ≤0.03 |
| Diagonal deviation | 1mm | 1mm | 1mm | 1mm |
| Thermal conductivity | ≥25W/MK at 300℃ | ≥25W/MK at 300℃ | ≥18W/MK at 300℃ | ≥18W/MK at 300℃ |
| Average thermal expansion coefficient (10-6/℃) | 10~12 | 10~12 | 15~17 | 15~17 |
2. Product features of 1.0-2.5mm Thick High Yield Strength Copper Clad Laminate CCL Lamination Steel Plate Japanese Metallurgical NAS630 ESSP-CCL-400
Main features of Copper Clad Laminate CCL Lamination Steel Plate ESSP-CCL-400:
1). Copper Clad Laminate CCL Lamination Steel Plateis using the highest end steel plate raw materials (made in Japan). The most advanced heat treatment technology and the latest grinding manufacturing process can well ensure that each lamination steel plate has reliable lamination performance in the process of CCL lamination.
2). It features the minimum high-temperature warpage degree with longer service life.
3). It has better thermal conductivity and thermal expansion coefficient.
4). High corrosion resistance and hardness.
5). Suitable for various types of lamination steel plate washing machines.
3. Technical parameters of 1.0-2.5mm Thick High Yield Strength Copper Clad Laminate CCL Lamination Steel Plate Japanese Metallurgical NAS630 ESSP-CCL-400
1). Steel material: Japanese metallurgical NAS630 and NAS301 (NAS630 is chosen or used more).
2). Conventional thickness (mm): 1.5, 1.6, 1.8, 2.0
3). Service life: 8-10 years (Note: after repeated usage, the steel plate will become thinner. It is not recommended to continue using after the thickness is less than 1.3mm/the steel plate thickness between 1.3-1.6mm should ensure no deformation or warping, and the hardness meets the standard).
4). Conventional size of CCL lamination steel plate (L * W in mm):
2220 * 1270/2210 * 1270/1910 * 1270/1500*1295/1300*800
/1295*787/1295*1613/1295*1143/1295*787
4. Application of 1.0-2.5mm Thick High Yield Strength Copper Clad Laminate CCL Lamination Steel Plate Japanese Metallurgical NAS630 ESSP-CCL-400
What is the definition of copper clad laminate (CCL)?
Copper clad laminate (CCL) is a plate-shaped material made by immersing electronic fiberglass cloth or other reinforcing materials in resin, covering one or both sides with copper foil, and then hot pressing, abbreviated as CCL. Various forms and functions of printed circuit boards are selectively processed, etched, drilled, and copper plated on copperclad laminates to produce different printed circuits. The main functions of printed circuit boards are interconnection, insulation, and support, which have a significant impact on the transmission speed, energy loss, and characteristic impedance of signals in circuits. Therefore, the performance, quality, processability, manufacturing level, manufacturing cost, and long-term reliability and stability of printed circuit boards largely depend on copperclad laminates.
FYI, CCL lamination steel plate is also named or called as CCL laminated steel plate, CCL pressed steel plate, CCL partition steel plate, CCL mirror steel plates or CCL pressing steel plate.
Our high-end lamination steel plates for copper clad laminate (CCL) is very adaptable to various CCL laminators like BURKLE, LAUFFER, CEDAL, HELD, DATIAN, WEIDI, DIPUER, etc.
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